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Cropping machine 72/454

Item number: VT1-00274

This machine is suitable for cutting squared and as grown mono crystalline silicon work pieces with a length of 1.200 up to 3.000 mm. The Maximal diameter of ingot is 230 mm, the cut off length is between 200 mm up to 1020mm.

 

equipped for fully automatic cropping process of complete ingot

that means, automatic feed in of ingot, positioning and cutting

of top/tail, slug(s) and segments and unloading without manual

interference.

thin blade water hydraulic guidance for thin diamond cutting discs

→ kerf loss < 1.7 mm

compact design

high machine availability  97% acc. to SEMI E10

very low tool costs → wheel life time between 12.000 and

15.000 cuts

high process stability

low investment costs

cutting force control for an optimized cutting process and to

avoid tool damages

Integrated vacuum chuck for top/tail and slug cut.

 

Technical Details

Downloads

Workpiece lengthMax. 3380 mm (incl. top and tail)
Workpiece diameter:169 x 169 mm² - 210 x 210 mm²
Workpiece formats (square)120 x 120 mm² - 160 x 160mm²
Dimensions of machine (LxWxH)5700 x 1700 x 2380 mm³
Weight of machineApprox. 4300 kg
Diameter of cutting disc700 mm
Cutting speed10 - 80 m/s (steplessly variable)
Cutting feed6 - 60 mm/min
Cutting length250 - 1000 mm
Manual

Download this manual as PDF-Document.