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Cutting machine 72/360

OD cropping machine

Item number: VT1-00231

This machine is suitable for cutting squared multi and mono crystalline silicon work pieces with a length of 50 up to 550 mm. The shortest cut off length is 10 mm.

 

equipped for manual and fully automatic loading, for instance with

help of an industrial robot

thin blade water hydraulic guidance for thin diamond cutting discs

→ kerf loss < 1.7 mm

compact design

very low tool costs → wheel life time between 12.000 and 15.000

cuts

high process stability

low investment costs

high machine availability  97% acc. to SEMI E10

cutting force control for an optimized cutting process and to avoid

tool damages caused by SiC-inclusions

cut off less than 10mm with vacuum chuck possible

 

 

Specifications:

arithmetical surface roughness Ra <= 0,8 µm

average surface roughness Rz <= 8 µm

parallelism <0,2 mm

angle tolerance <0,3 mm

eveness <0,1 mm

 

Throuhgput:

cycle time <= 10 minutes per cut (incl. loading, unloading)

for work piece format 156 mm x 156 mm

 

Properties

Technical Details

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Video

  • equipped for manual and fully automatic loading, for instance with help of an industrial robot
  • thin blade water hydraulic guidance for thin diamond cutting discs => < 1,7 mm
  • compact design
  • high machine uptime 97%
  • low tool costs => wheel life time > 3 months
  • high process stability
  • low investment costs
  • cutting forcecontrol for an optimized of the cutting process to avoid tool damages caused by SiC-inclusions
Work piece length:50 - 550 mm
Work piece format:120 x 120 mm² / 160 x 160 mm²
Disc diameter:550 - 700 mm
Cutting speed:30 - 80 m/s
Cutting feed:6 - 60 mm/min
Cutting length:max. 400 mm
Compressed air:6 - 8 bar
Coolant:Water
Weight: approx. 1500 kg
Manual

Download this manual as PDF-Document.