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Squaring saw 72/476

Item number: VT3-00261

With two parallelly arranged diamond precision cutting discs. Machine is suitable for squaring mono crystalline ingots with of work piece diameter of 150 - 230 mm (wafer format 125 x 125 mm or 156 x 156 mm). Segment lengths of 200 – 2500 mm can be processed. With water hydraulic guidance for thin diamond cutting discs as well as cutting force and automatic feed control


equipped for manual and fully automatic loading, for instance with

help of an industrial robot

high flexible machine concept

flexible and easy processing of different ingot and segment lengths

and diameters

low investment costs

high process stability

high machine availability  97% acc. to SEMI E10

low tool costs è high lifetime of cutting discs

thin blade water hydraulic guidance for thin diamond cutting discs

-> diamond layer  thickness  < 2.0 mm

cutting force control for an optimized cutting process

ingots as grown can be processed without preparation



  • SPS Simatic – S7/317
  • High end industrial PC with dual core processor
  • 15“ touch panel with HMI, visualisationon WinCC flexible
  • machine table driven via AC-servo motor, toothed belt and ballscrew
  • cutting aggregate driven via AC-servo motor with infinitely variable torque adjustment
  • precision spindle bearing with air protection
  • pneumatic clamping of workpiece
  • automatic fixation and hold of slabs via vacuum
  • cutting spindle with centrifugal cooling
  • ARPAT – „Arnold Remote Production Analysis Tool“ - machine internal MES (option)

Download this manual as PDF-Document.