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Chamfer and round Grinding Machine 72/856

Artikelnummer: VT4-00220 / VT4-00221 / VT4-00222 / VT4-00223

This machine is suitable for chamfer and round grinding of squared mono-crystalline silicon work pieces with three grinding aggregates (2x pre-, 1x fine grinding) and one additional grinding aggregate for OD grinding.

 

 

 

 

The fully automatic machine excels by following advantages:

edge grinding of flat (45°) and round chamfers

fully automatic machine concept

adaptive Grinding Process Control

unique, pneumatic clamping and centring of the work pieces,

even in case of a rectangular brick shape

the squared ingots can be processed without preparation

(for instance glueing of centering or clamping pieces)

automatic edge detection and adjustment of grinding tools with

ingot length detection, for an optimized cycle time, by using

high-resolution measurement systems

detection and evaluation of the work piece specific quality data

after grinding, for instance chamfer size, chipping and unground

chamfer sections

automatic wheel correction

high process stability

high machine availability 97% acc. to SEMI E10

equipped with two loading zones for manual and fully automatic

loading, for instance with the help of an industrial robot

high throughput, even when a high removal of silicon is achieved

by using 4 grinding wheels with a separate pre-, fine- and finish

grinding process

 

Specifications:

arithmetical surface roughness Ra <= 0,15 µm¹

average surface roughness Rz <= 1,5 µm¹

geometric toleranzes +/-0,05 mm

angularity 90° +/-0,05°

 

Throuhgput round grinding:

cycle time <= 13,5 minutes (incl. loading, truning and

unloading)

diameter as grown ø 210 mm, grinded diameter ø 200 mm

and a work piece length of 500 mm

 

 

 

¹ sufrace quality depents on used grinding wheel diamond sizes

Eigenschaften

Technische Daten

Downloads

Video

  • grinding spindles (4 pieces) with air protected spindle bearings
  • infinitely variable grinding spindle drive (4 pieces) via AC-servo motor
  • linear axis (5 pieces) with ballscrew via AC-servo motor drive
  • CPU Siemens S7/317
  • high end industrial PC with dual core processor
  • 15” tough panel with HMI, visualisation based on WinCC flexible
  • integrated recipe management
  • high-resolution laser measuring sensors (2 pieces)
  • Option: ARPAT – “Arnold Remote Production Analysis Tool“ – machine internal MES
Machine (LxWxH)approx. 6800 x 2290 x 2035 mm
Weightapprox. 8200 kg
Workpiece format125 x 125 mm²; 156 x 156 mm²
Workpiece length180 - 600 mm
Handbuch

Laden Sie sich das Handbuch als PDF-Dokument herunter.