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Cutting machine 72/360

Flash is required!

This machine is suitable for cutting squared multi and mono crystalline silicon work pieces with a length of 50 up to 550 mm. The shortest cut off length is 10 mm.


equipped for manual and fully automatic loading, for instance with

help of an industrial robot

thin blade water hydraulic guidance for thin diamond cutting discs

→ kerf loss < 1.7 mm

compact design

very low tool costs → wheel life time between 12.000 and 15.000


high process stability

low investment costs

high machine availability  97% acc. to SEMI E10

cutting force control for an optimized cutting process and to avoid

tool damages caused by SiC-inclusions

cut off less than 10mm with vacuum chuck possible