This machine is suitable for chamfering and round grinding of squared mono-crystalline silicon workpieces in the format of 156 x 156 mm and 210 x 210 mm, with three grinding aggregates (2 x pre-, 1 x fine grinding) and one additional grinding aggregate for OD grinding.

Workpiece lengths of 450 up to 1000 mm can be processed.

The fully automatic grinding machine excels by the following advantages:

• grinding of flat (45°) and round chamfers

• unique, pneumatic clamping and centring of the work pieces, even in case of a rectangular brick shape

• the squared ingots can be processed without preparation (for instance glueing of centering- or clamping pieces)

• automatic edge detection and adjustment of grinding tools with ingot length detection, for an optimized cycle time, by using high-resolution measurement systems

• detection and evaluation of the work piece specific quality data after grinding, for instance chamfer size, chipping and unground sections

• automatic wheel correction

• equipped with two loading zones for manual and fully automatic loading, for instance with the help of an industrial robot

• high throughput, even when a high removal of silicon is achieved by using 4 grinding wheels with a separate pre- and fine grinding process, for instance:

Ingot diameter as grown:   ø 204 mm

Final ingot diameter:            ø 200 mm

Ingot length:                          1000 mm

Cycle time:                             < 48 Min.

Machine capacity:                  approx. 9.800 bricks/year

(based 24/7-production)

Quality data of workpiece:

•   DIN EN ISO 1101 evenness +/- 0,1 mm

•   DIN EN ISO 1101 roundness < 0,1 mm up 200 mm

•   DIN EN ISO 1101 concentricity ≤ 0,2 mm

•   Average value Ra ≤ 0,15 µm