This machine is suitable for chamfering and round grinding of squared mono-crystalline silicon workpieces in the format of 156 x 156 mm and 210 x 210 mm, with three grinding aggregates (2 x pre-, 1 x fine grinding) and one additional grinding aggregate for OD grinding.Workpiece lengths of 180 up to 600 mm can be processed.

The fully automatic grinding machine excels by the following advantages:

• grinding of flat (45°) and round chamfers

• unique, pneumatic clamping and centring of the work pieces, even in case of a rectangular brick shape

• the squared ingots can be processed without preparation (for instance glueing of centering- or clamping pieces)

• automatic edge detection and adjustment of grinding tools with ingot length detection, for an optimized cycle time, by using high-resolution measurement systems

• detection and evaluation of the work piece specific quality data after grinding, for instance chamfer size, chipping and unground sections

• automatic wheel correction

• equipped with two loading zones for manual and fully automatic loading, for instance with the help of an industrial robot

• high throughput, even when a high removal of silicon is achieved by using 4 grinding wheels with a separate pre- and fine grinding process, for instance:

Ingot diameter as grown:  ø 203 mmFinal ingot diameter:           ø 195 mmIngot length:                         500 mmCycle time:                            < 30 Min.Machine capacity:                 approx. 15.000 bricks/year (based 24/7-production)Quality data of workpiece: • DIN EN ISO 1101 evenness +/- 0,1 mm• DIN EN ISO 1101 roundness < 0,1 mm up 200 mm• DIN EN ISO 1101 concentricity ≤ 0,2 mm • surface roughness Ra ≤ 0,15 µm