This machine is suitable for grinding from even (45°) or round chamfer of squared mono- and multi crystalline silicon workpieces with diameter format 90 - 210 mm, with two grinding aggregates (1 x cup wheel, 1 x fine profile wheel).

With the machine can be processed workpiece lengths of 100 – 1000 mm, a combination of several workpieces is possible.

The machine excels by following advantages:

• grinding from even (45°) or round chamfers

• high flexible machine concept

• low investment costs

• low cost of ownership

• low tool costs => high lifetime of grinding disks ≥ 6 months

• machine uptime 97%

Quality data of workpiece:

average value Ra ≤ 0,7 µm (profiling)

average value Ra ≤ 0,1 µm (chamfering 45°)