With two parallelly arranged diamond precision cutting discs. Machine is suitable for squaring  mono crystalline ingot with work piece diameter of 150 - 210 mm (wafer format 125 x 125 mm

or 156 x 156 mm). Segments of 200 – 2500 mm can be processed.

With water hydraulic guidance for thin diamond cutting discs as well as

cutting force and automatic feed control.

The fully automatic machine excels by the following advantages:

• equipped for manual and fully automatic loading, for instance with help of an industrial robot

• high flexible machine concept

• flexible and easy processing of different ingot and segment lengths

and diameters

• low investment costs

• high process stability

• low tool costs => high lifetime of cutting discs

• low kerf-loss by thin blade guidance ≤ 1,7 mm

• high technical machine availability 97%

• cutting force control for an optimized cutting process

• ingots as grown can be processed without preparation

Quality data of workpiece:

• average value:                             Ra ≤ 0,6 µm

• angularity:                                     < +/- 6,5 min

• geometric tolerance block width:  < +/- 0,2 mm