This machine is suitable for cutting squared and as grown mono crystalline silicon work pieces with a length of 1.200 up to 3.000 mm. The Maximal diameter of ingot is 230 mm, the cut off length is between 200 mm up to 1020mm.

■ equipped for fully automatic cropping process of complete ingot

■ that means, automatic feed in of ingot, positioning and cutting

■ of top/tail, slug(s) and segments and unloading without manual

■ interference.

■ thin blade water hydraulic guidance for thin diamond cutting discs

■ → kerf loss < 1.7 mm

■ compact design

■ high machine availability  97% acc. to SEMI E10

■ very low tool costs → wheel life time between 12.000 and

■ 15.000 cuts

■ high process stability

■ low investment costs

■ cutting force control for an optimized cutting process and to

■ avoid tool damages

■ Integrated vacuum chuck for top/tail and slug cut.