This machine is suitable for cutting of multi crystalline silicon workpieces up to diameter format of max. 210 x 210 mm with a workpiece length between 100 and 500 mm. Minimum segment length is 10 mm.

The fully automatic machine excels by the following advantages:

• equipped with two loading areas for manual and fully automatic loading, for instance with help

of an industrial robot

• compact construction

• pneumatic clamping of workpiece and segment

• machine uptime 97%

• cutting force supervision for optimization of cutting process and avoiding of tool damages based on SiC-inclusion

• high throughput

Workpiece:                156 x 156 mm²

Cycle time:                 ≤ 10 Min

Machine capacity:     approx. 47.000 cuts/year

(based on 24/7-production)

Quality data of workpiece:

• angularity              ≤ 0,2 mm

• evenness               ≤ 0,2 mm

• chips, cracks, steps ≤ 0,5 mm