with water hydraulic saw blade guidance for thin diamond cutting discs as well as cutting force surveillance and automatic feed control
This machine is suitable for cutting mono-crystalline ingots (incl. top und tail cutting, as well as cutting of test wafers). It is constructed for a workpiece diameter of up to max. 210 mm with a workpiece length of max. 3000 mm (without top and tail pieces).
Universal cutting saw Machine is suitable for cutting of squared multi- and mono crystalline silicon workpieces and is used for Top&Tail - cutting and recycle cuts. Machine is suitable for workpiece diameter 120 -160 mm with a workpiece length between 50 and 550 mm, minimum segment length is 10 mm.
